Electroplating for Surface Mount Components.

Mounting of Surface Mount Components

Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics, have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers, pagers, camcorders, etc., have been reduced by as much as 3/4 of their original introductory size and weight. The most significant contributing factor to thi...

Practical Considerations For Attaching Surface-mount Components

What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount compon...

Optimisation for Surface Mount Placement Machines

Optimisation of feeder setup and component placement sequence are very important to the efficiency of surface mount placement machines. Much works have been conducted to solve this problem. However, the technological characteristics of the placement machine influences the nature of the planning problems to be solved and the formulation of the associated models. As a result, little consensus exi...

Solder Paste Stencil for Surface Mount Technology

Solder paste masks or stenc.ils are an integral part of the manufacturing process for surface mount circuit boards. This study will examine the feasibility of developing a process for rapidly ' Currently at IUA-Tencor Corporation, San Jose, CA 0-7803-6482-1 /OO/$lO.OO 02000 IEEE 2000 IEEWCPMT Int'l Electronics Manufactluring Technology Symposium

Reflow Soldering Guidelines for Surface - Mount Devices